The first-class production comes from the first-class design. Huaqiang's fast production can not be separated from the cooperation of your design. Every engineer, please design according to the detailed description of the conventional production process.
Detailed design parameters:
1. via hole (commonly known as conductive hole)
1. Minimum aperture: 0.3mm (12mil)
2. The minimum through hole (VIA) aperture is not less than 0.3 mm (12 mil), the one side of the pad should not be less than 6 mil (0.153 mm), and the best size is greater than 8 mil (0.2 mm). This is very important. The design must be considered.
3. It is very important that the distance between VIA holes and holes (from hole edge to hole edge) should not be less than: 6mil is better than 8mil, so the design must be considered.
4. 0.508mm (20mil) distance between pad and outline line
Two. Line
1. Minimum line spacing: 6mil (0.153mm).. The smallest distance is from line to line. The distance from line to pad is not less than 6 mil. From the production point of view, the bigger the distance is, the better. Generally, it is 10 mil. Of course, under the condition of design, the bigger the distance is.The better this is, the more important it is. Design must be considered.
2. Minimum linewidth: 6mil (0.153mm). That is to say, if the line width is less than 6 mil, it will not be able to produce. (The minimum line width is 8 MIL in the inner layer of multi-layer board). If the design conditions permit, the bigger the design, the better the line width, we Huaqiang fast.The better the factory produces, the higher the yield. It is very important that the general design is about 10 mil. The design must be considered.
3. The distance between line and outline is 0.508mm (20mil)
3. PAD pad (commonly known as plug-in hole (PTH))
1. It is very important that the outer ring of PTH pad should not be less than 0.2mm (8mil) on one side. The bigger the size of PTH pad, the better it is. The design must be considered.
2. The distance between PTH holes and holes (hole edge to hole edge) should not be less than 0.3 mm. Of course, the bigger the better, the better this is very important. Design must be considered.
3. The size of the plug-in hole depends on your component, but it must be larger than your component pin. It is suggested that the pin should be larger than 0.2mm or above, that is to say, 0.6. You should design the pin at least as 0.8, in order to avoid the difficulty of insertion due to machining tolerance.
4. 0.508mm (20mil) distance between pad and outline line
Four. Solder resist.
1. Plug-in hole window opening, SMD window opening unilateral should not be less than 0.1mm (4mil)
5. Characters (Character design directly affects production. Whether the characters are clear or not depends on character design).1. Character width should not be less than 0.153 mm (6mil), character height should not be less than 0.811 mm (32mil), and the best ratio of width to height is 5. That is to say, character width of 0.2mm is 1 mm high, and so on.
6. Minimum spacing of non-metallic groove hole and groove hole is not less than 1.6 mm, otherwise it will greatly increase the difficulty of milling.Seven: imposition
1. Whether there are gaps or not, the gaps should not be less than 1.6 mm (1.6 thickness) or it will greatly increase the difficulty of milling. Different sizes of the assembly worksheet depend on different equipment, no gaps.The margin of patchmaking should not be less than 5 mm when the margin is 0.5 mm or soRelated matters needing attention
I. Original Document on PADS Design
1. In the PADS of double-panel file, the through attribute should be selected, the blind buried hole attribute cannot be selected, and the drilling file cannot be generated, which will lead to the leakage of drilling holes.
2. Do not add slots in PADS, because GERBER can not be generated properly. In order to avoid leakage slots, Please add slots in Drill Drawing.
3. PADS is paved by copper. The manufacturer is Hatch. After the original documents of customers are changed, they should be re-paved and saved (copper is paved by Flood) to avoid short circuit.
II. Documents on PROTEL99SE and DXP Design
1. Solder mask layer is the standard of the manufacturer's solder resistance. If Paste layer needs to be made, and the multi-layer solder resistance window can not generate GERBER, please move to the solder resistance layer.
2. Do not lock the outline in Protel99SE, and GERBER cannot be generated normally.
3. Do not select KEEPOUT option in DXP file. It will screen outline and other components and can not generate GERBER.
4. Attention should be paid to the positive and negative design of these two documents. In principle, the top layer is orthographic, the bottom layer should be designed as negative, and the manufacturer should stack the boards from the top layer to the bottom layer. Monolithic board should pay special attention to, do not mirror arbitrarily! If we can't do it well, we will do it.Coming out is counter.
Other matters needing attention
1. Shape (such as frame, slot, V-CUT) must be placed in KEEPOUT layer or mechanical layer, not in other layers, such as screen printing layer, circuit layer. All grooves or holes requiring mechanical moulding should be placed in one layer as far as possible to avoid leaking grooves or holes.
2. If the two layers of mechanical layer and KEEPOUT layer have different shapes, please make special instructions. In addition, the effective shape should be given. If there is an inner groove, the line segments of the outer shape of the plate at the intersection of the inner groove should be deleted, so as to avoid leakage of the gong and inner groove, and designed in the mechanical layer.
The grooves and holes of KEEPOUT layer are usually made by non-copper holes (when making film, we need to dig out copper). If metal holes need to be treated, please make special remarks.
3. With three software designs, please pay special attention to whether the button bit needs copper exposure.
4. If the safest way to metallize the grooves is to assemble multiple pads, it will not be wrong.
5. Golden finger plate under the order, please make special remarks on whether to do bevel chamfering treatment.
6. Please check whether there are few layers in GERBER files. Generally, the manufacturer will make GERBER files directly.
7. Under normal circumstances, Gerber uses the following naming methods:
Component Surface Circuit: GTL Component Surface Resistance Welding: GTS
Component Surface Character: GTO Welding Surface Circuit: GBL
Welding Surface Resistance: GBS Welding Surface Character: GBO
Shape: gko porous graph: GDD
Drilling: drll
